发明名称 加工装置
摘要 PROBLEM TO BE SOLVED: To eliminate a product defect of a workpiece due to peel charging by properly removing static electricity accumulated when the workpiece is peeled from a table.SOLUTION: A processing device (1) sucks a wafer (W) held on a chuck table (5) or spinner table (14) by transport means (30, 50) and also changes a link of the spinner table (14) to a negative pressure generation source (8) to a link to an air supply source (9), jetting ionized air to the wafer (W) by ion blow means (6) when the wafer (W) is peeled from a suction chuck (7, 16), and allows transport means (30, 50) to transport the wafer when a determination part (41) determines the charging amount of the wafer (W) becomes less than a predetermined value.
申请公布号 JP6076063(B2) 申请公布日期 2017.02.08
申请号 JP20120269983 申请日期 2012.12.11
申请人 株式会社ディスコ 发明人 三浦 誠治;出島 健志
分类号 H01L21/677;H01L21/683 主分类号 H01L21/677
代理机构 代理人
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