发明名称 |
METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE COMPOUNDS, BISEPOXIDES AND HALOBENZYL COMPOUNDS |
摘要 |
Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features. |
申请公布号 |
EP3128044(A1) |
申请公布日期 |
2017.02.08 |
申请号 |
EP20160182480 |
申请日期 |
2016.08.02 |
申请人 |
Rohm and Haas Electronic Materials LLC;Dow Global Technologies LLC |
发明人 |
THORSETH, Matthew;NIAZIMBETOVA, Zuhra;QIN, Yi;WOERTINK, Julia;KOZHUKH, Julia;REDDINGTON, Erik;LEFEBVRE, Mark |
分类号 |
C25D3/38;C25D5/02;C25D7/00 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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