| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer flexible wiring board, excellent in folding resistance, insulation reliability and heat resistance.SOLUTION: A manufacturing method of a multilayer flexible wiring board of the present invention includes the steps of: providing an external conductive layer via an uncured adhesive resin on a conductive layer of a core substrate; forming a conformal mask to the external conductive layer; dissolving and removing the uncured adhesive resin by an alkaline solution via the conformal mask to form a via hole; thermally curing the uncured adhesive resin; plating the inside of the via hole to electrically connect the conductive layer of the core substrate and the external conductive layer; and forming a wiring circuit to the external conductive layer.SELECTED DRAWING: Figure 3 |
