| 摘要 |
There are provided a thermosetting resin composition for semiconductor bonding and a thermosetting resin composition for light emitting device which have high thermal conductivity and an excellent heat dissipation property and are capable of reliable pressure-free bonding of a semiconductors element and a light emitting element to a substrate. A thermosetting resin composition comprising: (A) silver fine particles ranging from 1 mn to 200 nm in thickness or in minor axis; (B) a silver powder other than the (A), the silver powder having an average particle size of more than 0.2 µm and 30 µm or less; (C) resin particles; and (D) a thermosetting resin, wherein an amount of the (C) is 0.01 to 1 part by mass and an amount of the (D) is 1 to 20 parts by mass, to 100 parts by mass being a total amount of the silver fine particles (A) and the silver powder (B), a semiconductor device using the resin composition as a die attach paste, and an electrical/electronic component using the resin composition as a material for heat dissipation member bonding. |
