发明名称 脆性材料基板のブレイク装置
摘要 PROBLEM TO BE SOLVED: To provide a device for breaking a brittle material substrate having projections formed thereon, without breaking the projections.SOLUTION: A break device breaks a brittle material substrate W having projections 13 formed in a lattice shape and protruding from a surface of the substrate W by pressing the substrate W by a break bar 22 from a reverse side of the substrate W along a scribe groove S formed between the adjacent projections 13 on the surface of the substrate W. An elastic sheet 16 having a lattice-like recess 15 corresponding to a position of each projection 13 formed thereon is used. The elastic sheet is put on the substrate so that each projection 13 is filled into the recess 15. The substrate W is placed on support means 21 so that the elastic sheet 16 comes into contact with the support means 21. The break bar 22 is pressed from the reverse side of the substrate W to break the substrate W.
申请公布号 JP6078107(B2) 申请公布日期 2017.02.08
申请号 JP20150120819 申请日期 2015.06.16
申请人 三星ダイヤモンド工業株式会社 发明人 武田 真和;村上 健二;田村 健太
分类号 B28D5/00;B26F3/00;B28D7/04 主分类号 B28D5/00
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