| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed circuit board including an element having high reliability which uses Sn based alloy solder for mounting of an inner layer in the method of manufacturing the printed circuit board including the element in a laminate printed circuit board.SOLUTION: A predetermined surface mounting element is surface-mounted to the element mounting side by using Sn based alloy solder, and Sn of the solder surface of a mounting substrate and the electrode surface of an element is selectively etched by an etchant of Sn, so that an oxide film 28 is formed on the solder surface, a rich layer of other metal constituting the electrode surface, and this metal surface, and the irregularities are formed on the solder surface and the electrode surface. |
