| 摘要 |
A wafer circuit, including: a wafer (10), fixed on a substrate; an electrode (20), arranged on the wafer (10); a bonding pad (30), arranged on the substrate; and a plurality of bonding wires (40) with first ends all connected to the electrode (20) and second ends all connected to the bonding pad (30), wherein the plurality of bonding wires (40) are parallel bonding wires. |
