发明名称 半導体用複合基板のハンドル基板
摘要 An alumina purity of translucent polycrystalline alumina forming a handle substrate is 99.9 percent or higher, and a porosity of the polycrystalline alumina is 0.01% or more and 0.1% or less. A number of pores, each having a size of 0. 5µm or larger and included in a surface region on a side of a bonding face of the handle substrate is 0.5 times or less of a number of pores, each having a size of 0.1 µm or larger and 0.3 µm or smaller and contained in the surface region.
申请公布号 JP6076486(B2) 申请公布日期 2017.02.08
申请号 JP20150536335 申请日期 2015.01.13
申请人 日本碍子株式会社 发明人 宮澤 杉夫;岩崎 康範;高垣 達朗;井出 晃啓;中西 宏和
分类号 H01L21/02;H01L27/12 主分类号 H01L21/02
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