| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film which improves mold release property (especially reduces peeling failures due to excessive adhesion between the mold release film and a CL adhesive) when a CL film is adhered to a circuit exposure film and has good embedding properties similar to those of the previous mold release film.SOLUTION: There is provided a mold release film provided with a mold release layer which comprises at least a polybutylene terephthalate homopolymer (A) and a copolymer (B) of a polybutylene terephthalate component and a polytetramethylene glycol component. |
