| 摘要 |
A component mounting device (1) includes a mounting head (6B) that is movable in a horizontal direction and mounts a held component (C) on a substrate (P) and a control portion (111) that controls the operation of the mounting head, and the control portion is configured to perform control of making a speed of mounting, by the mounting head, a component to be closely adjacent to another component and to be mounted on the substrate such that an interval to an adjacent component is equal to or less than a predetermined threshold, on the substrate, smaller than a speed of mounting in a normal state in which the mounting head mounts a component, which is not the component to be closely adjacent to another component, on the substrate. |
