| 摘要 |
This electronic component assembly is provided with a metal container, and an electronic component that is immobilized inside the metal container. The electronic component comprises an electronic component, and a plurality of conductive pins connected to the electronic component via an insulating layer. One end of each of the plurality of conductive pins extends to a connector connection space inside the metal container. An IC tag is positioned inside the insulating layer, in the vicinity of any one of the plurality of conductive pins. A positioning part corresponding to the position of the IC tag is provided to the metal container. |
