| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer substrate capable of restraining a land and an inner layer wiring from being short-circuited even when cracks are generated on a build-up layer.SOLUTION: A glass cloth 30b in a build-up layer 30 is deformed toward a land 61 below the land 61. Then, thickness a1 of a resin layer 30c from the glass cloth 30b to a surface of the land 61 side is made larger than thickness b1 to a surface on a core layer 20 side. Thereby, progress or enlargement of smaller cracks can be restrained. Accordingly, the progress and enlargement of the cracks can be delayed. As a result, even when cracks are generated, an insulation property can be secured between the land and an inner layer wiring, so as to restrain short-circuit between them. |
