发明名称 レーザ接合装置
摘要 PROBLEM TO BE SOLVED: To provide a laser joining apparatus that when irradiating laser beam to a laminate between a first member and a second member and joining the first member and the second member, can improve adhesion between the first member and the second member in a junction area joined by the laser irradiation.SOLUTION: The laser joining apparatus comprises first and second pressing members that press a laminate from a laser irradiation portion side and the opposite side of the laser irradiation portion, and relatively moves the laminate, the laser irradiation portion, the first pressing member and the second pressing member along a predetermined direction. The first and second pressing members are configured so that the first and second members are arranged separating from each other in a direction orthogonal to the predetermined direction during joining. Condensed Laser beam is irradiated to the laminate so that the focal point of the condensed laser beam is concentrated on the area along the direction orthogonal to the predetermined direction, between the second pressing member and the first pressing member during the joining.
申请公布号 JP6075046(B2) 申请公布日期 2017.02.08
申请号 JP20120269107 申请日期 2012.12.10
申请人 アイシン精機株式会社 发明人 吉田 敬;太田 道春;加藤 千豊;服部 芳夫
分类号 B23K26/21;B23K26/70 主分类号 B23K26/21
代理机构 代理人
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