| 摘要 |
A sputtering device 1 includes: a vacuum chamber 2; a plurality of targets 8 (8a to 8d); a shield 9 that selectively exposes, to the inside of the vacuum chamber 2, only a target 8c out of which a film is to be formed; a substrate holding unit 11 that holds a substrate 10 on which fine particles ejected from the target 8c are deposited to form a film; a first transfer unit 14 that fixedly holds and moves the substrate holding unit 11; a mask 16 disposed between the substrate 10 and the target 8c; a second transfer unit 19 that moves the mask 16; and a plurality of through-hole units 17a to 17f having patterned through holes 17 penetrating through the mask 16. |
