| 发明名称 |
Flexible LED device with wire bond free die |
| 摘要 |
An article includes a flexible polymeric dielectric layer having first and second major surfaces. The first major surface has a conductive layer thereon and at least one cavity therein. The at least one cavity contains a conductive material including electrically separated first and second portions supporting and electrically connecting a light emitting semiconductor device to the conductive layer on the first major surface. |
| 申请公布号 |
US9564568(B2) |
申请公布日期 |
2017.02.07 |
| 申请号 |
US201514859512 |
申请日期 |
2015.09.21 |
| 申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
Palaniswamy Ravi;Jesudoss Arokiaraj;Narag Alejandro Aldrin II Agcaoili;Foo Siang Sin;Tan Fong Liang;Ouderkirk Andrew J.;Mooney Justine A. |
| 分类号 |
H05K1/02;H01L33/64;H01L33/48;H01L23/00;H01L33/60;H01L33/62;H05K1/18 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
Kusters Johannes P. M.;Richardson Clifton F. |
| 主权项 |
1. An article comprising:
a flexible polymeric dielectric layer having first and second major surfaces, the first major surface having a first conductive layer thereon and having at least one cavity therein, the at least one cavity containing a conductive material including electrically separated first and second portions, the first and second portions having respective first and second top surfaces facing the first major surface and opposing first and second bottom surfaces facing the second major surface, the first and second top surfaces configured to support and electrically connect a light emitting semiconductor device to the first conductive layer, the second major surface having a second conductive layer thereon, wherein the at least one cavity is at least 10% filled with an additional conductive material. |
| 地址 |
St. Paul MN US |
