Detection of lost wafer from spinning chuck

摘要

The disclosure relates to systems and methods for detecting when a microelectronic substrate is no longer properly secured or lost from a rotating chuck. A microelectronic substrate may be secured to a rotating chuck that may rotate the substrate when exposing the substrate to the chemicals during a treatment in a process chamber. The rotating chuck may include one or more detectors to detect the position of a gripping mechanism that secure the microelectronic substrate. The detectors may generate an electrical signal that correlates to the position of the microelectronic substrate. When the electrical signal(s) exceed a threshold the system may stop rotating the chuck to prevent additional damage to the process chamber.

主权项

1. A method for treating a microelectronic substrate, comprising:
securing the microelectronic substrate to a rotating chuck in a chemical processing system using a gripping mechanism that grips the microelectronic substrate in a desired position in a manner such that the position of the gripper mechanism changes if the microelectronic substrate is unsecured; rotating the microelectronic substrate using the rotating chuck; detecting a position of the gripping mechanism as the rotating chuck rotates; using the detected position of the gripping mechanism to determine if the microelectronic substrate is unsecured from the rotating chuck; and decreasing a rotational speed of the rotating chuck if the detected position of the gripping mechanism indicates the microelectronic substrate is unsecured.