Biopolymer optical analysis device and method

摘要

The present invention provides a device and method for analyzing the characteristics of a biopolymer with excellent mechanical stability, high spatial resolution and sensitivity using a simple device construction. Specifically, the Raman scattered light of a biopolymer is measured and the properties of monomer units forming the biopolymer are analyzed by using a biopolymer property analysis chip (100a) characterized by comprising: a solid substrate (110); at least one nanopore (120) disposed in the solid substrate (110); and one or more electrically conductive thin films (130a, 130b) disposed on the solid substrate (110). The biopolymer property analysis chip (100a) is characterized in that the electrically conductive thin films (130a, 130b) are disposed partially on the solid substrate (110) where the nanopore (120) is formed and a biopolymer which has penetrated into the nanopore (120) is caused to generate Raman scattered light by means of irradiation with external light.

主权项

1. A biopolymer property analysis chip comprising:
a solid state substrate having a thin film made of an electric insulator material; at least one nanopore formed in the solid state substrate; and at least one electroconductive thin film disposed on the solid state substrate, wherein
the nanopore penetrates through the thickness of the thin film made of an electric insulator material,the electroconductive thin film is disposed partially in contact with a circumference of the nanopore,a biopolymer which has penetrated into the nanopore is caused to generate a Raman scattered light by irradiation with an external light, andonly a portion of the entire circumference of the nanopore has a plasmon resonance member structure,the plasmon resonance member structure is an electroconductive thin film consisting of a single layer,the plasmon resonance member structure is not in contact with another conductive material,the electroconductive thin film is disposed in a middle depth of the nanopore along its central axis in the solid state substrate,the thin film of the electric insulator material including a first film and a second film, andthe electroconductive thin film is sandwiched between the first film and the second film, such that a top surface and a bottom surface of the electroconductive thin film are not exposed.