Methods of forming stacked microelectronic dice embedded in a microelectronic substrate

摘要

Embodiments of the present description include stacked microelectronic dice embedded in a microelectronic substrate and methods of fabricating the same. In one embodiment, at least one first microelectronic die is attached to a second microelectronic die, wherein an underfill material is provided between the second microelectronic die and the at least one first microelectronic die. The microelectronic substrate is then formed by laminating the first microelectronic die and the second microelectronic die in a substrate material.

主权项

1. A method of forming a microelectronic device, comprising:
attaching at least one first microelectronic die to a second microelectronic die with a plurality of interconnects; disposing an underfill material between the at least one first microelectronic die and the second microelectronic die after attachment; positioning a first laminate layer proximate the at least one first microelectronic die; positioning a second laminate layer proximate the second microelectronic die; and bringing pressure to bear on the first laminate layer and the second laminate layer to form a microelectronic substrate embedding the at least one first microelectronic die and the second microelectronic die therein.