Optical semiconductor device and method of producing the same

摘要

An optical semiconductor device including: a substrate having a principal surface; first and second optical waveguides disposed on the principal surface of the substrate, the first and second optical waveguides extending in a first direction, the second optical waveguide being arranged adjacent to the first optical waveguide in a second direction intersecting with the first direction; first and second signal electrodes disposed on the first and second optical waveguides; a resistor disposed on the principal surface, the resistor being arranged between the first optical waveguide and the second optical waveguide, the resistor being electrically connected to the first signal electrode and the second signal electrode; a resin layer disposed on the principal surface, top surfaces of the first and second signal electrodes, and the resistor; and a capacitor disposed on the resin layer, the capacitor being electrically connected to the resistor through an opening of the resin layer.

主权项

1. An optical semiconductor device comprising:
a substrate having a principal surface and a back surface opposite to the principal surface; a first optical waveguide disposed on the principal surface of the substrate, the first optical waveguide extending in a first direction; a second optical waveguide disposed on the principal surface of the substrate, the second optical waveguide extending in the first direction, the second optical waveguide being arranged adjacent to the first optical waveguide in a second direction intersecting with the first direction; a first signal electrode disposed on the first optical waveguide; a second signal electrode disposed on the second optical waveguide; a resistor disposed on the principal surface of the substrate, the resistor being arranged between the first optical waveguide and the second optical waveguide, the resistor being electrically connected to the first signal electrode and the second signal electrode; a resin layer disposed on the principal surface of the substrate, top surfaces of the first and second signal electrodes, and the resistor; and a capacitor disposed on the resin layer, the capacitor being electrically connected to the resistor through an opening of the resin layer.