Camera module having a buffer unit

摘要

A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.

主权项

1. A camera module, comprising:
a housing unit comprising a base; a holder module disposed over the base, wherein the holder module comprises:
a bobbin;an outer blade disposed outside the bobbin; anda spring member connecting the bobbin to the outer blade; a first coil wound on an outer lateral surface of the bobbin; a magnet configured to move the bobbin by interacting with the first coil; a second coil configured to move the holder module by interacting with the magnet; a wire configured to support a movement of the holder module; and a buffer unit comprising a bent or curved portion connected to the wire such that the buffer unit movably supports the holder module when a shock is applied to the camera module.