Package carrier, semiconductor package, and process for fabricating same

摘要

A package carrier includes: (1) a dielectric layer; (2) a first electrically conductive pattern, embedded in the dielectric layer and disposed adjacent to a first surface of the dielectric layer, and including a plurality of first pads; (3) a plurality of first electrically conductive posts, extending through the dielectric layer, wherein each of the first electrically conductive posts includes a first electrically conductive post segment connected to at least one of the first pads and a second electrically conductive post segment connected to the first electrically conductive post segment, and a lateral extent of the first electrically conductive post segment is different from a lateral extent of the second electrically conductive post segment; and (4) a second electrically conductive pattern, disposed adjacent to a second surface of the dielectric layer, and including a plurality of second pads connected to respective ones of the second electrically conductive post segments.

主权项

1. A semiconductor fabrication process, comprising:
(a) forming a first conductive pattern adjacent to a carrier; (b) forming a plurality of first conductive post segments on the first conductive pattern; and (c) applying a dielectric layer to the first conductive pattern and exposing the first conductive post segments, wherein (c) includes:
(c1) applying a dielectric layer to cover the first conductive pattern and the first conductive post segments;(c2) forming a plurality of openings in the dielectric layer, such that the first conductive post segments are exposed by the openings; and(c3) forming a plurality of second conductive post segments on the first conductive post segments and at least partially within the openings;wherein a diameter of each opening is smaller than a diameter of the corresponding first conductive post segment such that the diameter of each second conductive post segment is smaller than the diameter of the corresponding first conductive post segment.