发明名称 Memory chip and layout design for manufacturing same
摘要 A static random access memory (SRAM) chip including a plurality of SRAM cells and a plurality of cell current tracking cells. Each of the SRAM cells include a source voltage reference conductor, a first ground reference conductor, two cross-coupled inverters, and two pass-gate devices. Each cell current tracking cell include a first half-cell and a second half-cell. The first half-cell is different from the second half-cell.
申请公布号 US9564211(B2) 申请公布日期 2017.02.07
申请号 US201414317146 申请日期 2014.06.27
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 Liaw Jhon Jhy
分类号 G11C11/00;G11C11/419 主分类号 G11C11/00
代理机构 Hauptman Ham, LLP 代理人 Hauptman Ham, LLP
主权项 1. A static random access memory (SRAM) chip comprising: a plurality of SRAM cells, wherein each of the plurality of SRAM cells comprise: a source voltage reference conductor;a first ground reference conductor;two cross-coupled inverters, andtwo pass-gate devices; and a plurality of cell current tracking cells, wherein each of the plurality of cell current tracking cells comprises: a first half-cell, wherein the first half-cell comprises: a first tracking bit-line conductor;a first complementary metal oxide semiconductor (CMOS) comprising: a first pull down (PD) device, anda first pull up (PU) device, anda first pass-gate device configured to track a current; anda second half-cell, wherein the second half-cell comprises: a second CMOS comprising: a second PD device, anda second PU device, anda second pass-gate device configured to receive a word line signal; a plurality of capacitance tracking cells, wherein each of the capacitance tracking cells of the plurality of capacitance tracking cells comprise: a third half-cell comprising: a third pass-gate device configured to track a bit-line capacitance, anda third CMOS comprising: a third PU device, anda third PD device having a source node configured to be electrically floating;wherein the first half-cell is different from the second half-cell;wherein a gate of the first PD device of the first CMOS or a gate of the first PU device of the first CMOS is electrically connected to the source voltage reference conductor;wherein a drain node of the second PU device is electrically isolated from a drain node of the second PD device;wherein a gate node of the first pass-gate device is electrically connected to a tracking enable conductor; andwherein a gate node of the second pass-gate device is electrically connected to a first word-line conductor.
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