发明名称 Manufacturing method and apparatus for manufacturing silicon carbide epitaxial wafer
摘要 A manufacturing method for manufacturing a silicon carbide epitaxial wafer includes: introducing a cleaning gas into a growth furnace to remove dendrite-like polycrystal of silicon carbide attached to an inner wall of the growth furnace; after introducing the cleaning gas, bringing a silicon carbide substrate in the growth furnace; and growing a silicon carbide epitaxial layer on the silicon carbide substrate by introducing a processing gas into the growth furnace to manufacture a silicon carbide epitaxial wafer, wherein the cleaning gas having fluid energy of 1.6E-4 [J] or higher is introduced into the growth furnace.
申请公布号 US9564315(B1) 申请公布日期 2017.02.07
申请号 US201615091421 申请日期 2016.04.05
申请人 Mitsubishi Electric Corporation 发明人 Ohno Akihito;Sakai Masashi;Mitani Yoichiro;Yamamoto Takahiro;Kimura Yasuhiro;Mizobe Takuma;Tomita Nobuyuki
分类号 H01L21/02;C23C16/455;C23C16/44;B08B9/093 主分类号 H01L21/02
代理机构 Studebaker & Brackett PC 代理人 Studebaker & Brackett PC
主权项 1. A manufacturing method for manufacturing a silicon carbide epitaxial wafer comprising: introducing a cleaning gas into a growth furnace to remove dendrite-like polycrystal of silicon carbide attached to an inner wall of the growth furnace; after introducing the cleaning gas, bringing a silicon carbide substrate in the growth furnace; and growing a silicon carbide epitaxial layer on the silicon carbide substrate by introducing a processing gas into the growth furnace to manufacture a silicon carbide epitaxial wafer, wherein the cleaning gas having fluid energy of 1.6E-4 [J] or higher is introduced into the growth furnace, and wherein the cleaning gas includes only an inert gas, only hydrogen, or only a combination of an inert gas and hydrogen.
地址 Tokyo JP