Package structures and methods of forming the same

摘要

Packages structure and methods of forming them are discussed. A structure includes a first die, a first encapsulant at least laterally encapsulating the first die, and a redistribution structure on the first die and the first encapsulant. The second die is attached by an external electrical connector to the redistribution structure. The second die is on an opposite side of the redistribution structure from the first die. A second encapsulant is on the redistribution structure and at least laterally encapsulates the second die. The second encapsulant has a surface distal from the redistribution structure. A conductive feature extends from the redistribution structure through the second encapsulant to the surface of the second encapsulant. A conductive pillar is on the conductive feature, and the conductive pillar protrudes from the surface of the second encapsulant.

主权项

1. A structure comprising:
a first die having a first active side; a first encapsulant at least laterally encapsulating the first die; a redistribution structure on the first encapsulant and the first active side of the first die; a second die having a second active side, the second active side of the second die being attached by a first external electrical connector to the redistribution structure, the second die being on an opposite side of the redistribution structure from the first die; a second encapsulant on the redistribution structure and at least laterally encapsulating the second die, the second encapsulant having a first surface distal from the redistribution structure; a conductive feature extending from the redistribution structure through the second encapsulant to the first surface of the second encapsulant; and a first conductive pillar on the conductive feature, the first conductive pillar protruding from the first surface of the second encapsulant.