| 发明名称 | Devices and methods related to packaging of radio-frequency devices on ceramic substrates | ||
| 摘要 | Devices and methods related to packaging of radio-frequency (RF) devices on ceramic substrates. In some embodiments, a packaged electronic device can include a ceramic substrate configured to receive one or more components. The ceramic substrate can include a conductive layer in electrical contact with a ground plane. The packaged electronic device can further include a die having an integrated circuit and mounted on a surface of the ceramic substrate. The packaged electronic device can further include a conformal conductive coating implemented over the die to provide shielding functionality. The packaged electronic device can further include an electrical connection between the conformal conductive coating and the conductive layer. | ||
| 申请公布号 | US9564937(B2) | 申请公布日期 | 2017.02.07 |
| 申请号 | US201414528447 | 申请日期 | 2014.10.30 |
| 申请人 | Skyworks Solutions, Inc. | 发明人 | Lobianco Anthony James;Chen Howard E.;Whitefield David Scott |
| 分类号 | H04B1/38;H05K9/00;H01L21/48;H01L21/67;H01L23/15;H01L23/31;H01L23/06;H01L23/00 | 主分类号 | H04B1/38 |
| 代理机构 | Chang & Hale LLP | 代理人 | Chang & Hale LLP |
| 主权项 | 1. A packaged electronic device comprising: a ceramic substrate configured to receive one or more components, the ceramic substrate including a conductive layer in electrical contact with a ground plane; a die having an integrated circuit, the die mounted on a surface of the ceramic substrate; a conformal conductive coating implemented over the die and on the surface of the ceramic substrate extending to side edges of the ceramic substrate to provide shielding functionality; and an electrical connection between the conformal conductive coating and the conductive layer. | ||
| 地址 | Woburn MA US | ||