Wiring board, semiconductor device, and method of manufacturing wiring board

摘要

A wiring board includes a first insulating layer coating a first wiring layer. A first through hole is opened in a surface of the first insulating layer and exposes a surface of the first wiring layer. A first via arranged in the first through hole includes an end surface exposed to the surface of the first insulating layer. A gap is formed between the first insulating layer and the first via in the first through hole. A second wiring layer is stacked on the surface of the first insulating layer and the end surface of the first via. The second wiring layer includes a pad filling the gap. The pad is greater in planar shape than the first through hole.

主权项

1. A wiring board comprising:
a first insulating layer coating a first wiring layer; a first through hole that is opened in a surface of the first insulating layer and that exposes a surface of the first wiring layer; a first via arranged in the first through hole and including an end surface exposed to the surface of the first insulating layer; a metal film disposed between the first insulating layer and the first via in the first through hole, wherein the metal film forms a gap between the first insulating layer and the first via in the first through hole; and a second wiring layer that is stacked on the surface of the first insulating layer and on the end surface of the first via and includes a pad, the pad filling the gap and being greater in planar extent than the first through hole.