发明名称 |
Semiconductor package with integrated output inductor on a printed circuit board |
摘要 |
A semiconductor package includes a semiconductor die comprising a control transistor and a sync transistor, an integrated output inductor comprising a winding 1 around a core, and coupled to the semiconductor die. The winding comprises a plurality of conductive clips situated above a printed circuit board (PCB) and connected to a plurality of conductive segments in the PCB. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound. |
申请公布号 |
US9565768(B2) |
申请公布日期 |
2017.02.07 |
申请号 |
US201615013719 |
申请日期 |
2016.02.02 |
申请人 |
Infineon Technologies Americas Corp. |
发明人 |
Cho Eung San |
分类号 |
H05K1/18;H01L23/64;H01L23/538;H05K1/16;H01L23/00;H01L23/13 |
主分类号 |
H05K1/18 |
代理机构 |
Shumaker & Sieffert, P.A. |
代理人 |
Shumaker & Sieffert, P.A. |
主权项 |
1. A semiconductor package comprising:
a semiconductor die comprising a control transistor and a sync transistor; an integrated output inductor comprising a winding around a core, and coupled to said semiconductor die; wherein said winding comprises a plurality of conductive clips situated above a printed circuit board (PCB) and connected to a plurality of conductive segments in said PCB. |
地址 |
El Segundo CA US |