发明名称 Semiconductor device including FinFETs having different gate structures and method of manufacturing the semiconductor device
摘要 A semiconductor device includes a substrate having a logic device region including logic devices thereon, and an input/output (I/O) device region including I/O devices thereon adjacent the logic device region. A first fin field-effect transistor (FinFET) on the logic device region includes a first semiconductor fin protruding from the substrate, and a triple-gate structure having a first gate dielectric layer and a first gate electrode thereon. A second FinFET on the I/O device region includes a second semiconductor fin protruding from the substrate, and a double-gate structure having a second gate dielectric layer and a second gate electrode thereon. The first and second gate dielectric layers have different thicknesses. Related devices and fabrication methods are also discussed.
申请公布号 US9564435(B2) 申请公布日期 2017.02.07
申请号 US201514754400 申请日期 2015.06.29
申请人 Samsung Electronics Co., Ltd. 发明人 Chung Eun-ae;Choi Jung-dal;Nakanishi Toshiro;Kim Yu-bin;Nam Gab-jin;Lee Dong-kyu;Jiao Guangfan
分类号 H01L27/01;H01L27/12;H01L31/0392;H01L27/088;H01L21/8234 主分类号 H01L27/01
代理机构 Myers Bigel, P.A. 代理人 Myers Bigel, P.A.
主权项 1. A semiconductor device comprising: a substrate; a first fin field-effect transistor (FinFET) having a triple-gate structure that is on the substrate; and a second FinFET having a double-gate structure that is on the substrate, wherein the first FinFET is disposed in a first region of the substrate comprising logic transistors, and the second FinFET is disposed in a second region of the substrate comprising input/output (I/O) transistors.
地址 KR