发明名称 Elastic wave device
摘要 An elastic wave device making use of an SH plate wave propagating in LiNbO3 substrates includes a LiNbO3 substrate, IDT electrodes located on at least one surface of the LiNbO3 substrate, and a support which is bonded to the LiNbO3 substrate such that the support is located outside a region provided with the IDT electrodes and supports the LiNbO3 substrate, wherein θ of the Euler angles (0°, θ, 0°) of the LiNbO3 substrate ranges from about 92° to about 138° and the thickness of the LiNbO3 substrate ranges from about 0.05λ to about 0.25λ, where λ is the wavelength determined by the pitch between electrode fingers of the IDT electrodes.
申请公布号 US9564873(B2) 申请公布日期 2017.02.07
申请号 US201414170883 申请日期 2014.02.03
申请人 MURATA MANUFACTURING CO., LTD. 发明人 Kadota Michio
分类号 H03H9/02;H03H9/25 主分类号 H03H9/02
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. An elastic wave device comprising: a LiNbO3 substrate; an IDT electrode located on at least one surface of the LiNbO3 substrate; and a support arranged on the LiNbO3 substrate such that the support is located outside a region provided with the IDT electrode and supports the LiNbO3 substrate; wherein an elastic wave propagating in the LiNbO3 substrate is an SH plate wave; and θ of Euler angles (0°, θ, 0°) of the LiNbO3 substrate ranges from about 92° to about 138° and a thickness of the LiNbO3 substrate ranges from about 0.05λ to about 0.25λ, where λ is a wavelength determined by a pitch between electrode fingers of the IDT electrode.
地址 Kyoto JP
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