发明名称 Light emitting device and method for fabricating the same
摘要 Embodiments of a light emitting device and a method for fabricating the same are provided. The light emitting device comprises a cavity and one or more light emitting elements. The cavity is formed to a depth of 450 μm or less, and the light emitting elements are installed in the cavity. A fabricating method includes forming a package body having a cavity with a depth of 250 μm to 450 μm and at least one lead frame disposed at the bottom surface of the cavity, mounting at least one light emitting element on the lead frame, and molding a molding member in the cavity.
申请公布号 US9564556(B2) 申请公布日期 2017.02.07
申请号 US201313937899 申请日期 2013.07.09
申请人 LG INNOTEK CO., LTD. 发明人 Kong Sung Min
分类号 H01L33/60;H01L33/48;F21V8/00 主分类号 H01L33/60
代理机构 Ked & Associates, LLP 代理人 Ked & Associates, LLP
主权项 1. A side emission type light emitting device, comprising: a package body comprising a resin and a cavity which is provided with a bottom face and two pairs of opposite inner walls surrounding the bottom face, the package body including a front surface having an opening configured to be a top face of the cavity, a back surface disposed on an opposite side of the package body with respect to the front surface, and a bottom surface extending between the front surface and the back surface, the back surface including a recess recessed toward the front surface, the bottom surface including a stepped portion, the two pairs of opposite inner walls including a first inner wall, a second inner wall facing the first inner wall, a third inner wall, and a fourth inner wall facing the third inner wall; a lead frame including a mounting portion configured to form the bottom face of the cavity, and a flat portion extended from the mounting portion outside the package body, the flat portion disposed on the stepped portion of the bottom surface of the package body; and a light emitting element disposed on the mounting portion of the lead frame, wherein a distance from the front surface of the package body to the bottom face is less than 450 micro meters, wherein a bottom surface of the flat portion of the lead frame is positioned lower than the bottom surface of the package body, wherein a first angle between the first inner wall of the cavity and the second inner wall of the cavity is different from a second angle between the third inner wall of the cavity and the fourth inner wall of the cavity, wherein the first angle is greater than the second angle and no greater than 4.0 times the second angle, and wherein an angle of inclination of the third inner wall of the cavity with reference to an axis perpendicular to the bottom face of the cavity is different from an angle of inclination of the fourth inner wall of the cavity with reference to the axis perpendicular to the bottom face of the cavity.
地址 Seoul KR