Multi-stacked structures of semiconductor packages

摘要

A multi-stacked structure of semiconductor packages includes a plurality of substrates stacked in a vertical direction, semiconductor packages mounted on each substrate of the plurality of the substrates, a heat release column extending commonly through the plurality of the substrates and overlapping at least one semiconductor package serving as a heat generation source among the semiconductor packages in the vertical direction, and a heat dissipation part thermally connected to one end of the heat release column.

主权项

1. A multi-stacked structure of semiconductor packages, comprising:
a plurality of substrates stacked in a vertical direction, wherein at least one substrate comprises signal wirings and ground wirings; semiconductor packages mounted on each substrate of the plurality of substrates; a heat release column extending substantially vertically through the plurality of substrates, the heat release column overlapping at least one of the semiconductor packages serving as a heat generation source, wherein the heat release column is in contact with the ground wirings in the at least one substrate, and is spaced apart from the signal wirings in the at least one substrate; and a heat dissipation part thermally connected to one end of the heat release column.