发明名称 Isolation region fabrication for replacement gate processing
摘要 A method for isolation region fabrication for replacement gate integrated circuit (IC) processing includes forming a plurality of dummy gates on a substrate; forming a block mask over the plurality of dummy gates, such that the block mask selectively exposes a dummy gate of the plurality of dummy gates; removing the exposed dummy gate to form an isolation region recess corresponding to the removed dummy gate; filling the isolation region recess with an insulating material to form an isolation region; removing the block mask to expose a remaining plurality of dummy gates; and performing replacement gate processing on the remaining plurality of dummy gates to form a plurality of active devices, wherein at least two of the plurality of active devices are electrically isolated from each other by the isolation region.
申请公布号 USRE46303(E1) 申请公布日期 2017.02.07
申请号 US201514872790 申请日期 2015.10.01
申请人 Samsung Electronics Co., Ltd. 发明人 Anderson Brent A.;Nowak Edward J.
分类号 H01L21/338;H01L29/66;H01L21/28;H01L27/12;H01L21/84;H01L21/762 主分类号 H01L21/338
代理机构 Myers Bigel, P.A. 代理人 Myers Bigel, P.A.
主权项 1. A method for isolation region fabrication for replacement gate integrated circuit (IC) processing, the method comprising: forming a plurality of dummy gates on a substrate; forming a block mask over the plurality of dummy gates, such that the block mask selectively exposes a dummy gate of the plurality of dummy gates; removing the exposed dummy gate to form an isolation region recess corresponding to the removed dummy gate; filling the isolation region recess with an insulating material to form an isolation region; removing the block mask to expose a remaining plurality of dummy gates; and performing replacement gate processing on the remaining plurality of dummy gates to form a plurality of active devices, wherein at least two of the plurality of active devices are electrically isolated from each other by the isolation region.
地址 KR
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