| 摘要 |
The invention relates to a method for producing a component (100) having a semiconductor body (10) and a composite carrier (90), wherein the semiconductor body has connection points on the rear side, which are embedded in a partially cured joining layer (92), wherein the joining layer is cured in order to form a solid composite from the semiconductor body and the composite carrier, before a shaped body material for forming a shaped body (50) of the component is applied to the composite carrier and secured to the semiconductor body. The invention also relates to a component produced in particular using a method of this type, wherein the shaped body (50) covers side surfaces of the semiconductor body (10), and when the carrier layer (91) is viewed from above, entirely surrounds the semiconductor body and overlaps the joining layer (92). |
