STEALTH-DICING COMPATIBLE DEVICES AND METHODS TO PREVENT ACOUSTIC BACKSIDE REFLECTIONS ON ACOUSTIC WAVE DEVICES

摘要

Stealth-dicing-compatible devices and methods to prevent acoustic backside reflections on acoustic wave devices are disclosed. An acoustic wave device comprises a substrate having opposing top and bottom surfaces, where a first portion of the bottom surface has a higher roughness than a second portion of the bottom surface, and an acoustic resonator over the top surface of the substrate. The acoustic resonator comprises a piezoelectric layer having opposing top and bottom surfaces and a plurality of electrodes, at least some of which are disposed on the top surface of the piezoelectric layer. The first portion of the bottom surface of the substrate is below and opposite from the acoustic resonator, and the second portion of the bottom surface of the substrate is not located below and opposite from the acoustic resonator. Multiple first portions, each separated from the other by second portions, may exist.

主权项

1. An acoustic wave device, comprising:
a substrate having opposing top and bottom surfaces, wherein a first portion of the bottom surface has a higher roughness than a second portion of the bottom surface; and an acoustic resonator over the top surface of the substrate, the acoustic resonator comprising a piezoelectric layer having opposing top and bottom surfaces and further comprising a plurality of electrodes, at least some of which are disposed on the top surface of the piezoelectric layer, wherein the first portion of the bottom surface of the substrate is below and opposite from the acoustic resonator and the second portion of the bottom surface of the substrate is not located below and opposite from the acoustic resonator.