发明名称 |
PORTABLE LIGHT-EMITTING DEVICE WITHOUT PRE-STORED POWER SOURCES AND LED PACKAGE STRUCTURE THEREOF |
摘要 |
An LED package structure without pre-stored power sources includes a substrate unit and a LED chip. The substrate unit includes a carrier substrate, a positive conductive pin, and a negative conductive pin. The positive conductive pin is made of a first predetermined material with positive oxidation-reduction potential. The negative conductive pin is made of a second predetermined material with negative oxidation-reduction potential. The LED chip is disposed on the carrier substrate and electrically connected between the positive conductive pin and the negative conductive pin. Both the positive conductive pin and the negative conductive pin concurrently contact a predetermined liquid for generating oxidation-reduction reaction so as to generate electric powers with a predetermined driving voltage, and the LED chip is driven by the electric powers with the predetermined driving voltage for generating an indicator light source. The instant disclosure further provides a portable light-emitting device without pre-stored power sources. |
申请公布号 |
US2017033270(A1) |
申请公布日期 |
2017.02.02 |
申请号 |
US201615000291 |
申请日期 |
2016.01.19 |
申请人 |
HARVATEK CORPORATION |
发明人 |
Lu Hsin I;Wang Yu Ping;Chang Chia Pin;Huang Hui Yen |
分类号 |
H01L33/62;H01L33/48;F21V15/01;H01L25/16;F21K99/00;H01L33/60;H01L33/56 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
1. A LED package structure without pre-stored power sources, comprising:
a substrate unit comprising a carrier substrate, a positive conductive pin separated from the carrier substrate by a predetermined distance, and a negative conductive pin separated from the carrier substrate by a predetermined distance, wherein the positive conductive pin is made of a first predetermined material with positive oxidation-reduction potential, and the negative conductive pin is made of a second predetermined material with negative oxidation-reduction potential; a light-emitting unit disposed on the carrier substrate; and a voltage booster chip disposed on the carrier substrate and adjacent to the light-emitting unit, wherein the light-emitting unit and the voltage booster chip are electrically connected with each other. |
地址 |
HSINCHU CITY TW |