| 摘要 |
This invention enables Frequency Selective Surface (“FSS”) and Artificial Magnetic Conductor (“AMC”) which exhibits Electromagnetic Band Gap (“EBG”) in any of the substrate's layer from a small and thin systems and sub-systems in package to a large-format PCBs. The metamaterial substrate may be integrated with electronic circuit components or buried in PCBs for circuit designs capable of transmitting, receiving and reflecting electromagnetic energy, altering electromagnetic properties of natural circuit materials, enhancing electrical characteristics of electrical components (such as filters, antennas, baluns, power dividers, transmission lines, amplifiers, power regulators, and printed circuits elements) in systems and sub-systems circuit designs. The metamaterial substrate creates new electrical characteristics, properties and systems, sub-systems or component's specification not readily available with conventional circuit materials, substrates, and PCBs. The metamaterial substrate can be less than 70 μm thick and buried into any PCB layer. |
| 主权项 |
1. An apparatus comprising a substantially small sized and thinner electromagnetic band gap structure for a predetermined band gap frequency band, said apparatus comprising:
a. coplanar conductive unit elements that are periodically arrayed with an edge to edge spacing d between each of the adjacent said coplanar conductive unit elements forming a first layer, b. a dielectric having a thickness hr and a relative dielectric permittivity ∈r forming a second layer, c. a contiguous conductive plane forming a third layer, d. a capacitive surface means arranged in part by the length of the outer perimeter of each of said coplanar conductive unit elements, in part by the spacing d between each of the adjacent said coplanar conductive unit elements and in part by said relative dielectric permittivity ∈r of said dielectric for enabling a substantially increased distributed capacitance being electrically coupled in series between each of the adjacent said coplanar conductive unit elements in the array on said first layer, e. an inductive connection means arranged beside said capacitive surface means for enabling a substantially increased distributed inductance being electrically coupled in shunt between each of said coplanar conductive unit elements in the array on said first layer and said contiguous conductive plane on said third layer and with said dielectric therein, f. a composite reference plane comprised of said first layer, second layer and third layer to form a sufficient resonance circuit with said predetermined band gap frequency band by said capacitive surface means and said inductive connection means, g. a first miniature means originated from said inductive connection means for enabling a first ratio, alpha, of said thickness hr to the free space wavelength of at least one use frequency falling within said predetermined band gap frequency band, to be such that as to minimize said thickness hr while providing said sufficient resonance circuit of said composite reference plane, and h. a second miniature means originated from said capacitive surface means for enabling a second ratio, beta, of the length of at least one side of the outer perimeter of each of said coplanar conductive unit elements and a third ratio, gamma, of the spacing d respectively to at least one use frequency falling within said predetermined band gap frequency band, to be such that as to minimize the length of the outer perimeter and the spacing d while providing said sufficient resonance circuit of said composite reference plane, whereby the electromagnetic band gap structure can be made substantially thinner and smaller in dimensions which can be used to integrate with electrical circuits and microelectronic devices that have constraints in dimensions and thickness and means practical. |
