发明名称 STRUCTURE OF WATER-COOLING PIPING SYSTEM
摘要 A water-cooling piping system generally includes at least one water-cooling heat dissipation device, at least one heat dissipation conduit connected to one side of the water-cooling heat dissipation device, a hot flow tube arranged in the heat dissipation conduit, a cold flow tube arranged in the heat dissipation conduit and beside the hot flow tube, and an insulator arranged in the heat dissipation conduit. The insulator surrounds an outside wall of each of the hot flow tube and the cold flow tube to have the hot flow tube and the cold flow tube isolated from and independent of each other. With such an arrangement, the hot flow tube and the cold flow tube are arranged in the heat dissipation conduit to form an integrated structure so that the space occupied by the tubes can be reduced and the installation of the heat dissipation conduit and the water-cooling heat dissipation device can be simplified. In addition, the insulator is provided to isolate the hot flow tube and the cold flow tube from each other so as to effectively improve the overall water cooling effect.
申请公布号 US2017030493(A1) 申请公布日期 2017.02.02
申请号 US201514814517 申请日期 2015.07.31
申请人 EVGA CORPORATION 发明人 HAN TAI-SHENG
分类号 F16L9/19;H05K7/20 主分类号 F16L9/19
代理机构 代理人
主权项 1. A water-cooling piping system, comprising: at least one heat dissipation conduit, which is connected to at least one water-cooling heat dissipation device; a hot flow tube, which is arranged in the heat dissipation conduit; a cold flow tube, which is arranged in the heat dissipation conduit and beside the hot flow tube; and an insulator, which is arranged in the heat dissipation conduit, the insulator surrounding an outside wall of each of the hot flow tube and the cold flow tube so as to have the hot flow tube and the cold flow tube isolated from and independent of each other.
地址 New Taipei City TW