LABEL REMOVAL SOLUTION FOR LOW TEMPERATURE AND LOW ALKALINE CONDITIONS

摘要

According to the invention, the compositions and methods provide for the complete removal of synthetic glues or adhesives from a plurality of surfaces through the use of amide solvents in combination with surfactants, chelants, acidulants and/or additional bottle wash additives. Beneficially, the compositions and methods are suitable for use at lower temperatures, including below 35° C., and lower pH conditions, including from 5 to 10, from 6 to 9, and from 6 to 8, in comparison to conventional caustic-based adhesive removal compositions.

主权项

1. A method for removing labels containing adhesive material from a surface comprising:
applying a cleaning composition to a surface in need of removal of an adhesive material affixing a label to a surface; and removing said adhesive material from the surface within a period of time less than about 10 minutes; wherein the cleaning composition comprises an aqueous or non-aqueous saturated or unsaturated amide solvent, a chelant, a surfactant, and less than about 25 wt-% sodium hydroxide (caustic), wherein the amide solvent replaces at least a portion of a caustic solution, and wherein the temperature of the cleaning composition is below about 50° C. and the pH conditions of the cleaning composition is below about 10.