INTEGRATED LED MODULE WITH IMS SUBSTRATE

摘要

The present invention relates to a LED Module (10) comprising a first carrier (1) with at least one LED Chip (3) arranged thereon and a second carrier (2) on which electric components (4) for being connected to the at least one LED Chip (3) are arranged, wherein the first carrier (1) is an insulated metal substrate comprising a metal base material and a dielectric layer on which the at least one LED Chip (3) is arranged, wherein the second carrier (2) is a sheet-shaped circuit board arranged to at least partially cover a top surface of the first carrier (1) and which is electrically connected to the first carrier (1), and wherein the second carrier (2) comprises stress reducing means (8) which are arranged to at least partially surround or encompass electric connection means (7a) of the second carrier.