| 发明名称 |
POLISHING COMPOSITIONS AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME |
| 摘要 |
A polishing composition includes abrasive particles, a pyrrolidone containing a hydrophilic group, a dispersing agent, a first dishing inhibitor including polyacrylic acid, and a second dishing inhibitor including a non-ionic polymer. |
| 申请公布号 |
US2017029664(A1) |
申请公布日期 |
2017.02.02 |
| 申请号 |
US201615214847 |
申请日期 |
2016.07.20 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK Seung-Ho;JUNG Ki-Hwa;KIM Sang-Kyun;HWANG Jun-Ha;KWON Chang-Gil;BAEK Seung-Yeop;LEE Jae-Woo;LEE Ji-Sung;CHOI Jae-Kwang;HWANG Jin-Myung |
| 分类号 |
C09G1/02;H01L29/06;H01L21/3105;H01L21/762 |
主分类号 |
C09G1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A polishing composition, comprising:
abrasive particles; a pyrrolidone containing a hydrophilic group; a dispersing agent; a first dishing inhibitor including polyacrylic acid; and a second dishing inhibitor including a non-ionic polymer. |
| 地址 |
Suwon-si KR |
