| 发明名称 |
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A semiconductor structure includes a first device and a second device. The first device includes a plate including a plurality of apertures; a membrane disposed opposite to the plate and including a plurality of corrugations, and a conductive plug extending through the plate and the membrane. The second device includes a substrate and a bond pad disposed over the substrate, wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate includes a semiconductive member and a tensile member, and the semiconductive member is disposed within the tensile member. |
| 申请公布号 |
US2017029268(A1) |
申请公布日期 |
2017.02.02 |
| 申请号 |
US201514815220 |
申请日期 |
2015.07.31 |
| 申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. |
发明人 |
CHANG YI-HSIEN;CHENG CHUN-REN;SHEN WEI-CHENG;CHEN WEN-CHIEN |
| 分类号 |
B81B3/00;B81C1/00 |
主分类号 |
B81B3/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor structure, comprising:
a first device comprising:
a plate including a plurality of apertures;a membrane disposed opposite to the plate and including a plurality of corrugations, anda conductive plug extending through the plate and the membrane; and a second device comprising:
a substrate; anda bond pad disposed over the substrate,wherein the conductive plug is bonded with the bond pad to integrate the first device with the second device, and the plate includes a semiconductive member and a tensile member, and the semiconductive member is disposed within the tensile member. |
| 地址 |
Hsinchu TW |
