发明名称 Method of producing large-scale layers of solid material
摘要 The invention relates to a method of producing at least one layer of solid material (1). This method comprises at the very least the steps of:;providing a carrier substrate (2) with a first exposed surface (4) and with a second exposed surface (6);;producing a detachment layer (8) in the carrier substrate (2) or over the first exposed surface (4) of the carrier substrate (2), the detachment layer (8) having an exposed surface (10);;producing the that layer of solid material (1) over the exposed surface (10) of the detachment layer (8), the first layer of solid material (1) haying a free surface (12) spaced apart from the detachment layer (8);;positioning or forming a receiving layer (14) on the second exposed surface (6) of the carrier substrate (2) or on the free surface (12) of the first layer of solid material (1);;generating stresses within the detachment layer (8), the stresses being generated by tempering at least the receiving layer (14), a crack propagating within the detachment layer (8) or in the boundary region (16) between the detachment layer (8) and the first layer of solid material (1) as a result of the stresses, the first layer of solid material (1) being split off from the previously produced multi-layer arrangement by the crack.
申请公布号 US2017029974(A1) 申请公布日期 2017.02.02
申请号 US201415101783 申请日期 2014.12.04
申请人 SILTECTRA GmbH 发明人 LICHTENSTEIGER Lukas;RICHTER Jan;Drescher Wolfram
分类号 C30B1/02;C30B29/40;C30B33/00;H01L33/00;H01L33/32 主分类号 C30B1/02
代理机构 代理人
主权项 1. A method of producing at least one layer of solid material (1), comprising at the very least the steps of: providing a carrier substrate (2) with a first exposed surface (4) end with a second exposed surface (6); producing a detachment layer (8) in the carrier substrate (2) or over the first exposed surface (4) of the carder substrate (2), the detachment layer (8) having an exposed surface (10); producing a first layer of solid material (1) Over the exposed surface (10) of the detachment layer (8), the first layer of solid material (1) haying a free surface (12) spaced apart from the detachment layer (8); positioning or forming a receiving layer (14) on the second exposed surface (6) of the carrier substrate (2) or on the free surface (12) of the first layer of solid material (1); generating stresses within the detachment layer (8), the stresses being generated by tempering at least the receiving layer (14),a crack propagating within the detachment layer (8) or in the boundary region (16) between the detachment layer (8) and the layer of solid material (1) as a result of the stresses, the first layer of solid material (1) being split off from the previously produced multi-layer arrangement by the crack.
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