发明名称 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
摘要 A conductor trace is formed on a base insulating layer. The conductor trace includes two terminal portions and one wiring portion. The wiring portion is formed to connect the two terminal portions to each other and extend from each terminal portion. A metal cover layer is formed to cover the terminal portion and the wiring portion of the conductor trace and continuously extend from a surface of the terminal portion to a surface of the wiring portion. The metal cover layer is made of metal having magnetism lower than magnetism of nickel, and is made of gold, for example. A cover insulating layer is formed on the base insulating layer to cover a portion, of the metal cover layer formed on the conductor trace, covering the wiring portion and not to cover a portion of the metal cover layer covering the terminal portion.
申请公布号 US2017034909(A1) 申请公布日期 2017.02.02
申请号 US201615223241 申请日期 2016.07.29
申请人 Nitto Denko Corporation 发明人 YAMAUCHI Daisuke;TANABE Hiroyuki
分类号 H05K1/02;G11B5/48;H05K1/09;H05K3/46;H05K1/03 主分类号 H05K1/02
代理机构 代理人
主权项 1. A printed circuit board comprising: a first insulating layer; a conductor trace that is formed on the first insulating layer and has a terminal portion and a wiring portion extending from the terminal portion; a first metal cover layer provided to cover the wiring portion and the terminal portion and continuously extend from a surface of the terminal portion to a surface of the wiring portion; and a second insulating layer provided on the first insulating layer to cover a portion of the first metal cover layer covering the wiring portion and not to cover a portion of the first metal cover layer covering the terminal portion, wherein the first metal cover layer comes into contact with the wiring portion, the second insulating layer comes into contact with the portion of the first metal cover layer covering the wiring portion, and the first metal cover layer has magnetism lower than magnetism of nickel.
地址 Osaka JP