INTERNAL CONDUCTIVE ELEMENT FOR BONDING STRUCTURAL ENTITIES

摘要

An apparatus (100) comprising: first and second structural parts (102, 104) that are formed of a rigid material or a semi-rigid material; and a bond comprising a first adhesive (304) and at least one conductive member (502) disposed in a bonding area (306) between the first and second structural parts so as to securely couple the first and second structural parts together. The cure time of the first adhesive is decreased and a strength of the bond is increased during a bonding process by increasing a temperature of the first adhesive using the conductive member having electricity traveling therethrough.