| 主权项 |
1. A method for producing an electronic device comprising in a stack at least a first structure and a second structure, the structures being obtained from a first substrate and a second substrate, the method comprising the following steps:
forming at least one hollowed mark pattern on a second face, opposite a first face, of the first substrate; positioning of the first face of the first substrate on a first supporting member; positioning of a first face of the second substrate on a second supporting member; assembling the two substrates by the second face of the first substrate and a second face, opposite the first face, of the second substrate; separating the first substrate into two parts according to a dimension in thickness of the first substrate so as to form a first part of the first substrate remaining in position on the first supporting member, and a second part of the first substrate remaining assembled with the second substrate, the first part of the first substrate comprising a first mark formed by a first portion of the mark pattern, the second part of the first substrate comprising a second mark formed by a second portion of the mark pattern; producing at least one electronic component on the first part of the first substrate so as to form the first structure and of at least one electronic component on the second part of the first substrate so as to form the second structure; assembling the first structure and the second structure, the first face of the first substrate being in position on the first supporting member and the first face of the second substrate being in position on the second supporting member, by approaching the first supporting member and the second supporting member while aligning the first mark and the second mark. |
