MOUNT STRUCTURE, METHOD OF MANUFACTURING MOUNT STRUCTURE, AND WIRELESS DEVICE

摘要

Provided is a mount structure enabling joining of a first heat dissipater and a second substrate through a first substrate hole without using a binder such as a solder or an adhesive. The mount structure according to the present invention is provided with a first substrate (10) in which a through-hole (11) is formed, a second substrate (20) and a first dissipater (30) laid over on both surfaces of the first substrate (10) so as to cover the through-hole (11), and a second heat dissipater (40) held and attached between the second substrate (20) and the first heat dissipater (30) inside the through-hole (11).