COOLING AND UTILIZATION OPTIMIZATION OF HEAT SENSITIVE BONDED METAL TARGETS

摘要

A sputtering source (100) is described. The sputtering source includes a backing support (102) having a target receiving surface (112) and a further surface (110) opposing the target receiving surface, and at least one magnet assembly (115) provided adjacent the further surface, wherein the target receiving surface of the backing support has at least one recess (120), wherein the recess is provided opposite to the magnet assembly.