OPTOELECTRONIC COMPONENTS HOUSED IN A TO-CAN PACKAGE

摘要

Various types of optoelectronic components are housed inside a standard TO-can package. In a first exemplary embodiment, a sub-assembly is mounted on a substrate of a TO-can package such that a major surface of the sub-assembly is oriented orthogonal to a major surface of the substrate. The sub-assembly includes a light emitter and a light directing element that is arranged at a fixed distance from the light emitter prior to mounting of the sub-assembly on the substrate. The fixed distance is based on a first mounted distance formed between the light directing element and an optical window of the TO-can package when the sub-assembly is mounted on the substrate. In a second exemplary embodiment, a planar lightwave circuit incorporating an optical waveguide combiner, is mounted on the substrate of a TO-can package. The planar lightwave circuit includes two light emitters emitting light at different wavelengths into the optical waveguide combiner.

主权项

1. A light emitting device comprising:
an optical window that constitutes a light emitting surface of a TO-can package; a substrate located inside the TO-can package; and a sub-assembly mounted on the substrate such that a major surface of the sub-assembly is oriented orthogonal to a major surface of the substrate, the sub-assembly comprising:
a first light emitter; anda first light directing element arranged at a first fixed distance from the first light emitter prior to mounting of the sub-assembly on the substrate, the first fixed distance determined, at least in part, on a first mounted distance formed between the first light directing element and the optical window when the sub-assembly is mounted on the substrate.