RUGGEDIZED PHOTONIC CRYSTAL SENSOR PACKAGING

摘要

A method, system, and apparatus are disclosed for a ruggedized photonic crystal (PC) sensor packaging. In particular, the present disclosure teaches a ruggedized packaging for a photonic crystal sensor that includes of a hermetic-seal high-temperature jacket and a ferrule that eliminate the exposure of the optical fiber as well as the critical part of the photonic crystal sensor to harsh environments. The disclosed packaging methods enable photonic crystal based sensors to operate in challenging environments where adverse environmental conditions, such as electromagnetic interference (EMI), corrosive fluids, large temperature variations, and strong mechanical vibrations, currently exclude the use of traditional sensor technologies.

主权项

1. A method for hermetically sealing a sensor chip, the method comprising:
sealing the sensor chip to an end of a front snout of a main package body; inserting a fiber into the main package body through an opening of a back snout of the main package body; aligning an end of the fiber to the sensor chip; locking the fiber on a fiber pedestal, wherein the fiber pedestal is located inside the main package body; sealing the fiber at the end of the back snout of the main package body; applying a fiber jacket to an end of the fiber opposite the end of the fiber that is aligned to the sensor chip, wherein a portion of the fiber jacket is located inside of the back snout of the main package body; sealing an internal cavity of the back snout; attaching a fiber boot to the end of the back snout and to at least a portion of the fiber jacket; out-gassing the main package body, the sensor chip, the fiber, the fiber pedestal, the fiber jacket, and the fiber boot; and sealing a lid to a top side of the main package body.