METHOD FOR SMOOTHING SUBSTRATE SURFACE

摘要

Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

主权项

1. A method of adjusting a surface of a substrate, the method comprising:
comparing a contour of the surface to a reference contour of a reference surface; based upon the comparing, identifying a portion of the surface having a corresponding surface contour that is out of conformance with respect to the reference contour as: (1) a bump when the corresponding surface contour is proud of the reference contour, otherwise (2) as a divot; and bringing the corresponding surface contour of the identified portion into conformance by: depositing a first amount of filler material in a region around the bump, otherwise, depositing a second amount of filler material into the divot.